Memory Prices Rocket as AI Squeezes Supply Chain — Devices, OEMs and Shoppers Feel the Pinch

A sharp surge in memory and SSD prices driven by AI-related demand is pushing up the cost of laptops, phones and assembled PCs while inflating profits at major memory makers. Industry insiders expect the tightness to persist through 2026 as capacity expansion lags explosive demand for AI-optimised storage.

Close-up of a Seagate FireCuda SSD on a white background with three yellow rubber ducks.

Key Takeaways

  • 1DDR5 module prices have risen over 300% since September 2025; DDR4 is up more than 150%, according to market listings.
  • 2AI servers now consume a disproportionate share of DRAM and SSD capacity — industry figures suggest AI rigs account for about 53% of monthly DRAM output.
  • 3OEMs are raising retail prices and/or shipping lower base RAM to absorb part shortages; laptop list prices have increased by roughly 500–1,500 RMB in some cases.
  • 4Major memory IDMs (Samsung, SK Hynix, Micron) are reaping higher margins and stock gains, while capacity expansions will take months, implying persistent tightness into 2026–27.
  • 5Architectural changes (moving KV/context storage off GPU HBM and onto SSD) are multiplying enterprise SSD demand and reshaping the storage hierarchy for AI inference.

Editor's
Desk

Strategic Analysis

The memory-price shock is not a temporary hiccup but a symptom of a deeper structural pivot in computing: AI workloads have changed what ‘scarcity’ looks like. For a decade software and hardware designers treated compute cycles as the bottleneck; today high-capacity, low-latency context storage and large pools of DRAM are the constraint. That elevates the strategic importance of memory fabs and redistribution policies within supply chains. In the short term consumers and midsize OEMs will be squeezed; in the medium term expect accelerated capex from IDMs and potential policy responses to secure domestic supply. The risk of an eventual overshoot — where expanded capacity meets a still-maturing AI demand curve — creates a classic boom-bust investment risk for suppliers and investors. Companies with direct access to capacity and long-term supply contracts will gain disproportionate advantage, reinforcing concentration in a few large players and increasing geopolitical leverage associated with chip manufacturing.

China Daily Brief Editorial
Strategic Insight
China Daily Brief

Since late 2025 the price of computer memory has not simply risen — it has exploded. Online listings show DDR5 module prices up more than 300% from September 2025, while DDR4 has climbed over 150%. Shopkeepers in Shenzhen now print daily price sheets because “what’s listed today may not be the price tomorrow”, a signal of extraordinary volatility in a market that normally moves on a monthly cadence.

The proximate cause is a sudden and massive reallocation of storage and memory capacity toward artificial-intelligence workloads. AI servers demand far more volatile and persistent memory than conventional infrastructure: industry sources put AI servers’ DRAM consumption at eight to ten times that of ordinary servers, and claim AI rigs now account for roughly 53% of global monthly DRAM output. On top of that, new architectures announced at CES — most notably technologies that shift context storage from GPU HBM to local SSD — are multiplying enterprise SSD demand by terabytes per GPU.

The effects are cascading down the value chain. Cloud operators and hyperscalers are issuing huge procurement orders, prioritising high-end enterprise DRAM and SSD capacity. That soaks up the limited wafer and module supply available to consumer-product makers, squeezing the pool of parts for laptops, phones and boxed PCs. Retailers and small system builders report inventory losses: a 2TB Kioxia hard drive recently climbed from about 1,000 RMB to 1,500 RMB, and a consumer memory kit that sold for roughly 3,000 RMB in December is now fetching around 4,500 RMB.

OEMs are already passing costs on to buyers. Major laptop vendors including Lenovo, Dell and HP have applied list-price increases in the 500–1,500 RMB range on some models, and smartphone makers are subtly eroding value by shipping lower base RAM configurations rather than absorbing higher module prices. Promotions and discounts that kept device prices soft last year have thinned dramatically, leaving consumers effectively paying more for the same storage and memory specifications.

The supply squeeze is producing winners and losers. Memory manufacturers — particularly integrated device manufacturers (IDMs) such as Samsung, SK Hynix and Micron — are enjoying windfall profits and soaring share prices after investors re-rated their earnings forecasts. Several banks now predict steep year-on-year increases in average selling prices for server DRAM, while analysts raise 2026 profit estimates for the big fabs. But small module assemblers, consumer OEMs and end-users face mounting margin and affordability pressure.

Capacity expansions are in the works, but they are not an immediate panacea. Fab build-outs and process-node transitions require long lead times; the industry consensus is that new production will take months, not weeks, to alleviate shortages. That temporal mismatch means prices are likely to remain elevated through 2026 and possibly into 2027, according to several electronic-market analysts — a cycle driven less by supply disruptions than by a structural rebalancing of demand toward AI-optimised storage.

For consumers the near-term advice from vendors is unambiguous: buy early if you need it. System integrators suggest buying a “just-enough” configuration to get by rather than waiting for name-brand parts to fall back to pre-surge levels. For corporate buyers and cloud operators the calculus is different: securing supply now could be essential to maintaining service capacities and unit economics for AI services.

The broader consequence is a reordering of value across the technology stack. Where once compute cycles were the scarcest resource, context storage and memory bandwidth have become limiting factors for inference workloads. That shift will influence hardware design, procurement practices and capital expenditure priorities for data centres and device makers alike. It also increases the strategic value of memory-production capacity, concentrating leverage in a handful of East Asian fabs and heightening geopolitical and supply-chain sensitivities.

Policymakers and investors should watch for a few competing dynamics: high prices will encourage capex and capacity expansion, which could eventually create oversupply; but with AI demand accelerating and architectures evolving, any mismatch between build speed and appetite for storage could prolong a bull market for memory. For consumers and many OEMs, the immediate outcome will be higher device prices, thinner promotions and a temporary retrenchment in feature sets that rely on larger memory footprints.

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